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January 31, 2010

Huawei, Qualcomm complete interoperability tests on dual carrier HSPA+ technology

Reach peak downlink data rate of 42Mb/s

By CBR Staff Writer

Huawei along with partner Qualcomm, has completed first interoperability tests on dual carrier HSPA+ technology.

The company said that the dual-carrier HSPA+ technology is ready for commercial deployment, with tests reaching peak downlink data rate of 42Mb/s.

Huawei’s HSPA+ solution and Qualcomm’s mobile data modem MDM8220 chipsets were used in the interoperability test. Implemented with dual cell technology, the company said that it HSPA+ offering can transmit data through two or more carriers, resulting in the downlink data rate of 42Mb/s, which improves an operator’s spectrum resources, spectral efficiency and provides capacity gains of up to 20%.

Alex Katouzian, vice president of product management at Qualcomm CDMA Technologies, said: Qualcomm is pleased to be working with Huawei to bring dual-carrier HSPA+ technologies to market. We remain committed to WCDMA modem leadership and the seamless and cost-effective commercialization of next-generation technologies around the world.

Wan Biao, president of wireless at Huawei, said: Achieving higher speeds is a constant pursuit for customers and their subscribers. As a customer-centric company, Huawei is dedicated to developing innovative technology and cost-effective solutions and services. In cooperation with Qualcomm, we are able to deliver the latest in commercially available mobile broadband technology and user devices.

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