View all newsletters
Receive our newsletter - data, insights and analysis delivered to you
  1. Technology
January 17, 1988


By CBR Staff Writer

Engineers at Cornell University, New York, say they have developed a process that could reduce the cost of producing superconducting films for integrated circuits. The process, known as high-pressure reactive evaporation, uses ceramic materials discovered last year that start superconducting at the relatively high temperature of -183`C. It lowers fabrication temperatures from about 850`C to 700`C. This in turn reduces the risk of damage to other components on the chips. The cost of raw materials may also be cut using a Zirconium Oxide base, estimated at one-tenth the price of Strontium Titanate which is commonly used as a substrate. The process could lead to the use of inexpensive liquid Nitrogen for cooling and could open up a large number of practical applications. Superconductors offer no electrical resistance to current flow and could replace the present metal connections among components on chips. These produce unwanted resistance which slows down transmission rates and generates damaging heat. Cornell says the Yttrium Barium Copper Oxide film made using its process could sustain a current of about 1mA per square centimetre.

Content from our partners
Green for go: Transforming trade in the UK
Manufacturers are switching to personalised customer experience amid fierce competition
How many ends in end-to-end service orchestration?

Websites in our network
Select and enter your corporate email address Tech Monitor's research, insight and analysis examines the frontiers of digital transformation to help tech leaders navigate the future. Our Changelog newsletter delivers our best work to your inbox every week.
  • CIO
  • CTO
  • CISO
  • CSO
  • CFO
  • CDO
  • CEO
  • Architect Founder
  • MD
  • Director
  • Manager
  • Other
Visit our privacy policy for more information about our services, how New Statesman Media Group may use, process and share your personal data, including information on your rights in respect of your personal data and how you can unsubscribe from future marketing communications. Our services are intended for corporate subscribers and you warrant that the email address submitted is your corporate email address.