AT&T Bell laboratories and NEC Corp say that their collaboration on 0.35micron CMOS process technology has resulted in two new technologies, a chemical dry etching technique and a coherent Ti sputtering technique, which are used mainly to improve contact resistance, a task previously difficult to attain with conventional sputtering techniques; the new ultra-fine contact technology is aimed at the volume production of high-speed logic chips and 64M-bit and 256M-bit memory chips.
