AT&T Microelectronics and NEC Corp have extended their wide-ranging semiconductor agreements to cover development of a common process for manufacturing chips to 0.25 micron design rules. NEC and AT&T Microelectronics began a project to develop a 0.35 micron process in April 1991, and both companies are expected to have 0.35 micron chips in volume production by mid-1995. As in previous agreements, development work will be carried out at NEC’s facilities in Tokyo and at the AT&T Microelectronics facilities in the US, as well as AT&T Bell Laboratories. The research and development on common-core 0.25 micron process modules will be completed in mid-1995.
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