AMD has introduced two new dual-core, 18W TDP processors for the ASB1 BGA embedded client platform. The Turion Neo X2 processor Model L625 and the Athlon Neo X2 processor Model L325 are said to deliver PC-calibre performance in a low power envelope and with a ball grid array (BGA) package.
This embedded client product is suitable for traditional embedded applications such as single board computing and thin client systems as well as markets for self-service kiosks, point of sale machines and digital signage, the company said.
The BGA package reportedly helps alleviate reliability issues for systems that are deployed in rugged environments and has a low z-height that is designed to enable thin, compact enclosures.
The company claimed that the addition of the new dual-core processors to the ASB1 BGA platform can help increase the performance of existing single-core designs. When combined with either the AMD 780E or M690E chipset, embedded system designers can get an x86-based product that can offer enhanced graphics capability, which is becoming a growing necessity in many embedded markets.
Content from our partners
The two new processors also offer Error Correcting Code (ECC) to secure data transactions for enterprise-level designs.
Buddy Broeker, director of embedded computing solutions division at AMD, said: “We are committed to helping simplify the development cycle for our embedded customers with a platform that readily addresses the shifting needs of their markets.
“Systems such as digital signage, point of sale, and thin clients require PC-class performance and a rich graphics experience. Our ASB1 BGA platform is a ready-to-go, one-stop solution for these markets and at the same time offers the flexibility of multiple CPU and chipset choices.”
