The Procelerant CE945GM2A claims to replace older ETX technology at a comparable price point, enabling high-speed serial interface options such as PCI Express, Serial ATA (SATA) and gigabit ethernet.
The product can be combined with a RadiSys-designed low-profile active heat sink with an embedded fan allowing the module to be used in 1U platforms. The module and heat sink combination enable rapid design-in by removing the need for the customer to create a heat sink solution that can effectively cool a 1U system.
Wade Clowes, vice president of commercial segment at RadiSys, said: Customers have expressed the need to move away from legacy specifications like ETX, so that they can support current and future processors and I/O technologies on a modular form factor. COM Express accomplishes these goals with a truly open standard that prevents supplier lock-in, and this new RadiSys module lets our customers adopt COM Express at a price point that is very competitive with ETX.
