Samsung Electronics, a provider of semiconductor technology services, has rolled out a 64-gigabyte (GB) moviNAND memory device and a 32GB micro secure digital (microSD) memory card.
According to Samsung, the 64GB moviNAND, which measures 1.4mm in height, consists of 16 30nm-class 32Gb MLC NAND chips and a controller. The 17-die stack was achieved by using 30-micron thick chips and advanced package technology. moviNAND is available in 64GB, 32GB, 16GB, 8GB and 4GB densities.
The company said that the 32GB microSD card stacks eight 32Gb NAND components and a card controller. microSD card is enabled by the use of 30-nm class 32Gb NAND flash memory technology.
Previously, the highest density microSD card in production had a 16GB capacity and was based on 40nm-class 16Gb NAND. The new 32GB card is 1mm-thick and the portion of the card that is inserted into a handset measures just 0.7 mm in height, the company said.
Dong-Soo Jun, executive vice president of memory marketing at Samsung Electronics, said: “Samsung’s high-density memory solutions bring the storage capacity levels of computing systems to small, mobile devices. The 64GB embedded memory, moviNAND, and the 32GB microSD card each greatly expand the data storage density of mobile devices, meeting customers’ memory requirements and ushering in a new era of mobile and IT device capacity growth.”
The new 64GB moviNAND has been in mass production from December 2009, while the 32GB microSD is now being sampled with OEMs, with mass production expected from next month.
