Samsung Electronics, has unveiled 8Gb and 16Gb moviNAND embedded memory chips for use in smartphones. The new chips are compatible with the e-MMC specification, the JEDEC’s Embedded MultiMediaCard Product Standard v4.41.
The company said that the new offerings improve the responsiveness of the e-MMC device to the host or application processor.
Samsung Electronics flash memory planning/enabling vice president Seijin Kim said that company has already been providing new moviNAND offerings compatible with e-MMC v4.41 to a few key customers and getting a very positive response from them.
"These offerings are consistent with our commitment to provide a diversity of technologies for embedded memory to enhance its user-friendliness, in contributing to the rapid growth of the smartphone market," Kim said.
The new chips enhances user experience, with a high priority interrupt (HPI) and improved background operation features, the company said.
The moviNAND chips also allows efficient processing of orders, and if the host wants to execute an application or read data while the e-MMC device is writing data, the host can send an HPI command to the device so that the device stops previous writing to respond to the newest command.
The company said that when the embedded memory is not in operation, the host can command it to utilise the free time for background operations such as garbage compaction, so that the embedded memory can reduce the write latency.
Samsung is also introducing ultra-thin five chip multi-chip package (MCP) offerings which measure just 1millimeter (mm), over current four-chip MCPs that are 1.15mm in height (z-height).
