Golden Systems Middle East, a distributor of IT products, has introduced invisible heat sink DRAM module, the KINGMAX DDR3 2200MHz with Nano Thermal Dissipation Technology, in the Middle East region.
The new KINGMAX DDR3 2200MHz memory module, presents efficiency at the highest bandwidth up to 17.6GB/s, allows more data input and increases the system operating capability, the company said.
The KINGMAX applies the technology onto its series including 1600MHz, 2000MHz and 2200MHz, and features vertical industrial integration capabilities, R&D capability and patented technology.
Golden System Middle East product manager Gloria Choy said KINGMAX DDR3 2200MHz is the first DRAM module adopted Nano Thermal Dissipation technology in the world, which utilises nano-sized silicon and DLC (diamond-like-carbon) compound as the medium to increase the release of radiant heat.
"With KINGMAX’s advanced packing technology to integrate the material onto the chips, it shows great effect to pull the heat from the surface at a faster rate than the normal heat sink, and by adopting the invisible heat sink, it provides superior heat dissipation effect to boost overclocking performance and stability of the system.
"The no power request design also offers an economical operating environment, as well as compact product and package design reduces extra waste and transportation to green the environment," Choy added.
