Sierra Wireless (SWIR) has debuted its latest 4G LTE embedded module designed to be used in ultraportable notebooks, tablets, and other devices.
Dubbed the AirPrime EM7700, the module is 2.5 millimeters thick, which the company claims as the world’s first thin form factor (TFF) embedded wireless module for 4G LTE networks.
The module will initially connect to the AT&T 4G LTE network and is based on the AirPrime MC7700 module, which was certified by AT&T last year.
Designed to support Windows 8, the module uses Qualcomm’s Gobi 4G LTE modem, the MDM9200, and also supports HSPA+ on the AT&T network for use in areas where LTE is not yet available.
Shipments of the device are slated to commence in the second quarter of this year.
Sierra Wireless Mobile Computing senior vice president Dan Schieler said demand for smaller, thinner devices has continued to grow, and at the same time, we have become accustomed to being able to connect to high-speed networks from our gadgets anytime and anywhere.
"The AirPrime EM7700 module offers an innovative, much-needed solution for OEMs building 4G connectivity into ultra-thin devices, and we look forward to working with our customers to bring it to market in exciting new products."
"Mobile broadband data usage is on the rise, driven in no small part by gadgets like tablets and other ultra-portable devices," said.
