Qualcomm, a developer of wireless technologies, products and services, said that it has sampled its first dual-CPU Snapdragon chipsets. The Mobile Station Modem (MSM) MSM8660 and MSM8260 offerings integrate two of the company’s cores running at up to 1.2GHz.
The MSM8x60, which are third-generation chipsets from Qualcomm’s expanded Snapdragon platform, are targeted at high-end smartphones.
According to Qualcomm, the MSM8260 for HSPA+ and MSM8660 for multi-mode HSPA+/CDMA2000 1xEV-DO Rev. B feature two enhanced CPU cores running at up to 1.2GHz for web application and multimedia performance, including a powerful GPU with 3D/2D acceleration engines for Open GLES 2.0 and Open VG 1.1 acceleration.
In addition, the MSM8260 for HSPA+ and MSM8660 for multi-mode HSPA+/CDMA2000 1xEV-DO Rev. B also feature 1080p video encode/decode, dedicated low power audio engine, integrated low power GPS, and support for 24-bit WXGA 1280 x 800 resolution displays.
Qualcomm’s Snapdragon family of chipset offerings include, QSD8x50 with 1GHz enhanced core; QSD8x50A and MSM8x55 with 1GHz enhanced core, including multimedia optimisations and 1.3GHz enhanced core, respectively; and the third-generation products, QSD8672, MSM8260 and MSM8660 with dual-CPU architecture featuring enhanced cores running at up to 1.2GHz and 1.5GHz, respectively.
Steve Mollenkopf, executive vice president of Qualcomm and president of Qualcomm CDMA Technologies, said: “Qualcomm’s first-generation Snapdragon chipsets set a new standard for advanced smartphones and smartbook devices, and our second-generation solutions are already shipping in volume.
We are very excited by the innovation our customers are already showing as they begin designing products based on our dual-core MSM8260 and MSM8660 chipsets.”
