IBM and Samsung will work together to conduct basic research into new semiconductor materials, manufacturing processes and other technologies.
The US technology consulting firm and the South Korean electronics makers are jointly developing new semiconductor process technology that can be used in a broad range of applications ranging from smart phone handsets to communications infrastructure.
IBM scientists in the Semiconductor Research Alliance at the Albany Nanotech Complex in New York will be joined by Samsung researchers to study new materials, transistor structures, as well as innovative packaging solutions for next-generation technology nodes.
The study is likely to pave way for silicon offerings that can offer better performance, power consumption and size, IBM said.
The two companies are also renewing their joint process development agreement (JDA) to work on multiple nodes starting at 20nm.
They are also planning to develop advanced technologies for foundry customers, enabling high-performance, energy-efficient chips at 20nm and beyond.
