Fujitsu Microelectronics and Taiwan Semiconductor Manufacturing Company (TSMC) have agreed to collaborate on 28-nanometer (nm) process technology targeted for production of Fujitsu Microelectronics’ 28nm logic ICs and to jointly develop an improved 28nm process technology by utilising TSMC’s technology platform.
This agreement is expected to extend Fujitsu Microelectronics’ 40nm collaboration with TSMC that was announced earlier and cover joint development of 28nm process technology. Initial 28nm samples are expected to ship toward the end of 2010.
The companies claimed that this collaborative effort combines Fujitsu Microelectronics’ expertise in high-speed process and low-power design technologies with TSMC’s expertise in high-performance logic/SoC process and technology platform that is part of the Open Innovation Platform from TSMC.
The companies added that they are also discussing possibilities for collaborating on packaging that could include joint developments to combine Fujitsu Microelectronics’ strengths in lead-free and ultra-high-pin count packaging technologies, with TSMC’s strength in chip-package integration and advanced Cu/ELK interconnect.
Haruyoshi Yagi, corporate senior vice president of Fujitsu Microelectronics, said: “We are rapidly progressing in our previously-announced collaboration with TSMC on 40nm process technology, with several product designs in progress at present.
“With this further agreement with TSMC on 28nm high-performance process technology development and production, we combine both companies’ strengths to create greater value for our customers, and will further drive the growth of businesses for TSMC and Fujitsu’s ASIC and ASSP core products.”
