This agreement will enable ASAT to manufacture packages based on Amkor’s FusionQuad technology platform.
The FusionQuad packaging technology is based on a novel leadframe plastic encapsulated package that provides electrical and thermal performance for cost sensitive applications. FusionQuad technology integrates bottom lands within a standard QFP package outline to enable doubling of the interconnect density, improved signal integrity for high speed signals and higher power dissipation.
Amkor provides semiconductor assembly and test services. It offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services.
Jim Fusaro, corporate vice president of wirebond products at Amkor, said: The market has been seeking a low cost package technology to better serve applications in the 150 to 350 pin count range. We believe FusionQuad technology meets these cost sensitive requirements and also provides improved thermal and electrical performance for advanced applications. We are in the process of deploying this technology to meet challenging ASIC requirements in hard disk drive, multi-functional printer and HDTV applications.
Jeff Osmun, president of ASAT, said: ASAT and Amkor have enjoyed benefits from our licensing agreements in recent years and we are pleased to extend that cooperation to include the FusionQuad technology. Growth in QFP packages has been slowing as the technology has matured, with little innovation over the past few years. We believe the FusionQuad technology will inject new growth in the QFP family and is an attractive extension to our current package offerings.
