The two companies have been co-operating to advance the next-generation of Paratek’s ParaScan materials technology for high-volume manufacturing and to jointly develop tunable products that improve total radiated power (TRP) for mobile phones, leading to longer battery life and fewer dropped calls. Initial production is expected to take place at STMicroelectronics’s fabrication facility in Tours, France by the end of 2009.
With ST’s long-term experience, the companies said that they will implement ParaScan technology into high-reliability tunable capacitors. This is expected to allow the implementation of dynamic impedance matching for wireless handsets, which improves power amplifier efficiency and battery life while simultaneously reducing the likelihood of dropped or missed calls. ST’s knowledge of wireless portable applications is expected to enable the development of full system services compatible with very high volume production.
Jim DiLorenzo, president and CEO of Paratek, said: The joint product and system development work of the two companies will enable much broader and faster adoption of our tunable system solutions. Complementing the joint development activity, ST’s fab in Tours is ideally suited for the production of ParaScan wafers. Its Ipad technology is extremely synergistic with ours, allowing for maximum manufacturing efficiencies and flexibility.
