In the biggest endorsement yet of technology developed at the Austin, Texas-based Microelectronic & Computer Technology Corp research co-operative, DEC has adopted the Tape Automated Bonding technology developed under the co-op’s chip packaging technology research programme. DEC has been impatient to apply a more efficient technique for interconnecting integrated circuits in its computers, and hoped to use the wafer-scale technology developed at Dr Gene Amdahl’s ill-fated Trilogy Ltd. DEC reports that it will be using the Tape Bonding technology in the new VAX 6000 Model 400 machine, and says that as well as improving speed and reliability, the technology will enable it to reduce the size of the processor boards.
