Images of the iPhone 6s prototype logic board has surfaced online, showing that the next generation iPhone may incoporate a new NFC chip labeled as NXP 66VP2.
The new chip is an upgrade to the presently used NXP 65V10 NFC chip, and is expected to include a processor which will not need a separate chip to secure element processors.
According to the image obtained by 9to5Mac, the number of chipsets is less, as one of the boards that contained 10 components only has three main chips.
The company is reportedly using the same Cirrus Logic audio chip, a Murata Wi-Fi module, and wireless power amplifiers from RFMD, Triquint, and Avago for the next generation iPhone.
According to reports, the company is also planning to include a chip from STMicroelectronics, which has been used in the Apple Watch.
The images also revealed that the company could continue to have a 16GB base memory for iPhone 6S. However, it is being speculated that the inbuilt storage capacity could be more when the phone hits the market.
The phone is expected to be 7.1mm thick and will feature 12-megapixel rear camera.
